会议详情 |
2017-03-18 08:00 至 2017-03-20 18:00
推荐会议:2024年全国先进生产系统理论与应用研讨会暨国际产学研用合作会议智能制造论坛暨大湾区工业工程前沿论坛
发票类型:增值税普通发票 增值税专用发票
Welcome Message
The 4th Conference on Sensors and Networks (CSN 2017) will be held from March 18 to 20, 2017 in Xi'an, China. This Conference will cover issues on Sensors and Networks. It dedicates to creating a stage for exchanging the latest research results and sharing the advanced research methods.
CSN 2017 will be co-located with the following conferences:
The 6th Int'l Conference on Signal and Image Processing (CSIP 2017)
The 9th Int'l Conference on Computational Intelligence and Software Engineering (CiSE 2017)
The 4th Spring Conference on Wireless Communications and Networks (CWCN-S 2017)
CSN 2017 is devoted to the advancement of Sensors and Networks. A sensor is a transducer whose purpose is to sense (that is, to detect) some characteristic of its environs. A sensor network (SN) is consisted of multiple interconnected sensors. The scope of CSN 2017 covers both theoretical and practical areas of Sensors and Networks; Topical subheadings of interest include, but are not limited to the following: sensing elements and new technology of sensors, wireless sensor networks, sensor fusion and information processing, creative applications and services.
CSN 2017 will be a valuable and important platform for inspiring international and interdisciplinary exchange at the forefront of Sensors and Networks. The Conference will bring together academicians, scientists, engineers, and technicians from all over the world, and we hope that you will take this opportunity to join us for academic exchange and visit the city of Xi'an.
We look forward to seeing you in Xi'an in March 2017.
工程信息研究院,是一个国际学术机构,收集与发布最新的国际学术会议信息,促进学术交流和国际合作,每年与美国电气和电子工程师协会(IEEE)、汤姆逊公司(Thomson)、科学信息研究所(ISI)和美国科研出版社(SRP)等多家知名机构以及全球知名大学和科研机构合作举办国际学术会议。
Detailed program will be released in February. The provisional schedule is provided as follows:
|
March 18 |
March 19 |
March 20 |
March 21 |
8:30-10:00 |
|
Invited Speech Session |
Technical Session |
One-day Tour |
10:00-10:20 |
Coffee Break |
Coffee Break |
||
10:20-12:00 |
Invited Speech Session |
Technical Session |
||
14:00-16:00 |
Registration |
Invited Speech Session |
Technical Session |
|
16:00-16:20 |
Coffee Break |
Coffee Break |
||
16:20-18:00 |
Invited Speech Session |
Technical Session |
Alexander Denisov
哈尔滨工业大学
教授
Package A: Including Registration Fee + Hotel Fee + Oral Presentation
Item | Within 10 days after the acceptance notification | Before March 18, 2017 |
---|---|---|
Attendee | USD570/RMB3400 | USD640/RMB3800 |
Package A Includes:
Conference Materials(Including one Name Card,one hard copy of the Conference Guide and one hard copy of the Conference Proceeding)
Oral Presentation & A free paper abstract in the Conference Guide
All Technical Sessions during the whole conference
Lunch Buffet during the conference(March 19, 20)
Dinner Buffet during the conference(March 19)
Coffee Break
Hotel accommodation for two days includes the breakfast
Package B: Including Registration Fee + Oral Presentation
Item | Within 10 days after the acceptance notification | Before March 18, 2017 |
---|---|---|
Attendee | USD400/RMB2400 | USD450/RMB2700 |
Package B Includes:
Conference Materials(Including one Name Card,one hard copy of the Conference Guide and one hard copy of the Conference Proceeding)
Oral Presentation & A free paper abstract in the Conference Guide
All Technical Sessions during the whole conference
Lunch Buffet during the conference(March 19, 20)
Dinner Buffet during the conference(March 19)
Coffee Break
Package C: Only Registration Fee (No Oral Presentation)
Item | Before January 18, 2017 | Before March 18, 2017 |
---|---|---|
Attendee | USD360/RMB2160 | USD390/RMB2360 |
Registration Fee Includes:
Conference Materials(Including one Name Card,one hard copy of the Conference Guide and one hard copy of the Conference Proceeding)
All Technical Sessions during the whole conference
Lunch Buffet during the conference(March 19, 20)
Dinner Buffet during the conference(March 19)
Coffee Break
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