The 8th IEEE International Symposium on Next-Generation Electronics (ISNE 2019)

初稿截稿日期：2019-07-20

初稿录用通知日期：2019-07-25

Microelectronic Devices and Materials

• Silicon Integrated Circuits Technologies

• Advance Memories Technology (Flash, FeRAM, PCM，RRAM, MRAM etc.)

• Sensors and MEMS

• Organic Semiconductor Devices and Technologies

• Silicon Photonics

• Nano-Electronic and Nano-Photonic Devices

• Physics and Simulation of Optoelectronic Devices

Compound Semiconductor Materials, and Optoelectronic Devices

• Compound Semiconductor Materials, Devices and Technologies

• Optical Devices and Modules

• Optical Communication

• Fiber Optics and Fiber Sensing

• Optical Thin Films

• Laser Optics

• Nano-Electronic and Nano-Photonic Devices

• Physics and Simulation of Optoelectronic Devices

Renewable and Sustainable Energy Device and Materials

• Solid State Lighting and Displays

• Organic, Inorganic, and Hybrid Photovoltaics

• Nano-Electronic and Nano-Photonic Devices

• Energy Harvesting and Transferring Mechanisms

• Enabling Materials and Fabrication

• Transparent and Flexible Optoelectronics

• Renewable energy electronics

Integrated Circuits and Systems

• Analog and Mixed-Signal Circuits and Systems

• Wireline and Wireless Communication Circuits and Systems

• Data Converters

• Power Management and Converters

• Sensors and Actuators

• Embedded Systems, Multi/Many Core Systems & Embedded Memory Technologies

• Reconfigurable and Programmable Circuits and Systems

• System Level Design Methodology and Tools

• Design for Testability and Manufacturability

• Design Verification

Bioelectronics

• Processing/Devices/Circuits Modeling and Simulation

• Nano-Electronic and Nano-Photonic Devices

• Biomaterials

• Biomedical Devices

• MEMS & NEMS

• Sensors and Actuators

• Bioimages

• Bio Circuits and Systems

Sensors, Packaging Technologies, and Novel Applications in Science and Technology

• Sensor and Photodetectors

• Sensors and MEMS, Fiber Optics and Fiber Sensing

• Reliability, Packaging and Testing Technologies, Sensors and Photodetectors

• Package Technology

• Sensor Application in Science and Technology

• Sensors & Actuators

• Sensors Materials

• Sensors Technology

RF and Microwave Circuits

• RF circuits

• Microwave Circuits

• Millimeter Wave Techniques

• Antenna

• Electromagnetic Waves

• EMC & EMI

Computer Communication and Multimedia Techniques

• Computer Networks

• Software Defined Network (SDN)/Network Function Virtualization (NFV)

• Internet Applications

• Communication Protocols

• 5G Architecture and Communications

• Multimedia Systems and Applications

• Embedded Systems and Applications

• Mobile Computing

• Video/Audio Signal Processing

• Digital Signal Processing

• AR/VR technique

• Computer Vision

• Computer Graphics

IOT and AI Techniques

• Internet of Things

• Internet of Vehicle

• Artificial Intelligence

• Machine Learning

• Deep Learning

• Cloud Computing

• Big Data

Power and Control Engineering

• Power Systems

• Power Electronics

• Motor Control

• Remote Monitoring and Control

• Home Automation

• Intelligent Transportation Systems

• Automotive Electronics

Novel Applications in Electrical Engineering and Photonic Devices

Others

General Chair： 刘俊杰 周清雷

TPC CHAIR: 孙晓红 刘玉怀

Publication chair：薛琦