会议详情 菜单
2019年第49届欧洲微波会议 (EuMC 2019)

2019年第49届欧洲微波会议 (EuMC 2019)

2019-10-01 09:00 至 2019-10-02 18:00

Paris   None

IEEE Antennas and Propagation Society   IEEE Microwave Theory and Techniques Society   European Microwave Association - EuMA   

IEEE Antennas and Propagation Society

IEEE Antennas and Propagation Society于2020年2月25日举办2020 IEEE International Workshop on Antenna Technology (iWAT 2020)。

IEEE Microwave Theory and Techniques Society

IEEE Microwave Theory and Techniques Society于2019年12月5日举办2019 IEEE MTT-S International Microwave and RF Conference (IMARC)。

European Microwave Association - EuMA

European Microwave Association - EuMA于2019年11月4日举办2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems 。

会议简介

50 years after the first edition in 1969, the 49th European Microwave Conference (EuMC) remains the main event in the 2019 European Microwave Week, the largest event in Europe dedicated to microwave components, systems and technology.

The European Microwave Conference is a premier event to present the status and trends in the fi elds of microwave, millimetre-wave and terahertz systems and technologies. A broad range of high frequency related topics, from materials and technologies to integrated circuits, systems and applications will be addressed in all their aspects: theory, simulation, design, and measurement. Examples include the latest developments for filters and passive components, modelling and design of RF MEMS and microsystems, high frequency and high data rate microwave photonics, highly stable and ultra low-noise microwave and millimetre-wave sources, new linearization techniques, 5G, IoT, and the impact of new packaging technologies.

Special emphasis will be placed on emerging technologies and materials for microwave components such as nanotechnologies and graphene, metamaterial structures and devices, tuneable RF components, reconfi gurable RF systems and system-in-package.

The scope also includes electromagnetic field theory, theoretical and experimental developments in wave propagation and antenna systems, and advanced simulation and characterization techniques. An additional focus will be put on the system implications of future microwave communications, wireless power transfer, radar with wireless communication capability, millimetre-wave imaging systems, and microwaves in industrial and medical applications.

The European Microwave Conference provides many opportunities for networking and interaction with international experts in a wide variety of specialties, attracting delegates with academic as well as industrial backgrounds. With carefully selected papers in more than 40 oral and poster sessions, the conference represents an exciting forum for the presentation and discussion of the most recent advances in the microwave arena. In addition to scientifi c papers, contributions on industrial applications are also encouraged, covering the fields of instrumentation, medical, telecommunication, radar, space, automotive and defence systems, etc.Stéphane Bila


征稿信息
重要日期

初稿截稿日期:2019-02-11

征稿主题
PASSIVE COMPONENTS, CIRCUITS AND SUBSYSTEMS

E1 Planar Passive Components and Circuits:Planar transmission lines, couplers, dividers/combiners, hybrids, lumped-element circuits, tuneable planar components and devices
E2 Non-Planar Passive Components and Circuits:Non-planar micromachined transmission lines, waveguides, couplers, dividers/combiners, hybrids, tuneable components and devices
E3 Planar Filters and Multiplexers:Innovative synthesis and analysis, active filters
E4 Non-Planar Filters and Multiplexers:nnovative 3D filters and multiplexers, non-planar integrated technologies (LTCC, Liquid Crystal Polymer, MCM-Deposition)
E5 Smart materials, RF MEMS, MOEMS and NEMS:Bulk and thin-film ferrite components, ferroelectrics, surface and bulk acoustic wave devices including FBAR devices, RF microelectro-mechanical and micromachined components and systems
E6 Metamaterials, Frequency Selected Surfaces, and Electromagnetic Bandgap Structures:Components, circuits and systems using metamaterials, frequency selected surfaces and electromagnetic bandgap structures
E7 Interconnects, Packaging and Multi-Chip Modules:Assembly methods, hybrid integration, interconnects and multi-chip modules, heterogeneous IC technologies
E8 Emerging Materials and Technologies:Novel 2D/3D printing techniques, graphene, novel-material based nanotechnology, nanoscale components, superconducting materials and devices, additive manufacturing techniques, organic, transparent, textile and other

ACTIVE COMPONENTS, CIRCUITS AND SUBSYSTEMS

E9 Low Noise Circuits and Modules (*):LNA, detectors, receivers, radiometers
E10 Frequency Generation, Conversion and Control:Oscillators, VCOs, phase-locked loops and frequency synthesizers, mixers, frequency multipliers/dividers
E11 Front-End and Transceiver Modules, System-in-Package Technologies:Analog and digital front-end architectures, modulators/demodulators, analogue RF and mixed signal SIP, switches, phase shifters, limiters
E12 Tunable and Reconfigurable Circuits and Systems (*):Reconfigurable transceiver circuits, modules and amplifiers
E13 High Power Amplifiers:Hybrid power amplifiers, high power amplifiers, power combining techniques, vacuum electronics
E14 Power Amplifiers, Efficiency Enhancement and Linearization (*):Cartesian and polar power amplifi er design, behavioural modelling, continuous and switch mode operation, linearization and predistortion techniques, efficiency enhancement, adaptive gain control, matching and packaging, amplitude and phase characterization
E15 Sub-THz and THz Components, Circuits and Systems:Sources, detectors, and receivers, devices, components, and systems, modelling, simulation and analysis techniques
E16 Microwave Photonic Components, Circuits and Systems (*):Including indium phosphide and silicon nitride based photonic integrated circuits

FIELD AND CIRCUIT ANALYSIS, SIMULATION AND CHARACTERIZATION TECHNIQUES

E17 Electromagnetic Field Theory and Numerical Techniques:Frequency and time domain modelling, periodic structures, sparse arrays, simulation of electrically large problems, multi-scale and multi-physics approaches
E18 Electromagnetic Compatibility and Interference, Signal Integrity:Field emission and immission modelling and measurements, electromagnetic compatibility, robustness and interference issues, signal-fl ow device modeling, distortion and stability analyses, digital pre- and post-distortion techniques
E19 Interaction of Electromagnetic Waves with Matter, Biological Effects, Electromagnetic Scattering:Electromagnetic propagation and absorption phenomena, electrodynamic characterization of biological materials, interaction at atomic/ molecular/macroscopic level
E20 Measurement Techniques and Systems from RF to THz:Frequency and time domain measurements, automated performance testing

ANTENNAS AND PROPAGATION

E21 Antenna Design and Characterization (**):Modelling, calibration and measurements, antenna systems, multiple polarizations, multiple beams
E22 Integrated Antennas:Active antennas, reconfigurable antennas
E23 Phased Arrays (Active/Passive), Related Circuits and Components, Tx/Rx Module Technologies (**)Array design, feed and distribution network, phase shifters and delay lines, receive and transmit arrays, active and passive retrodirective arrays, bias and control circuitry, integration and packaging
E24 Smart Antennas, Digital Beam-Forming Antennas, MIMO AntennasSmart antennas, multi-beam antennas, beam forming and beam steering, analog and digital vectormodulators, multi-antenna systems, diversity schemes, MIMO antennas, massive-MIMO approaches
E25 Channel modelling and Measurements:Extended channel models, cluster emulation, narrowband and wideband channel measurements

SYSTEMS AND APPLICATIONS

E26 Microwave Systems:System simulation and characterization, base-station front-ends and handheld transceivers, satellite systems, navigation and positioning systems, industrial systems, vehicular applications and intelligent transportation systems
E27 Millimeter-wave, THz Technologies and Systems (**):mm-Wave and THz wireless communications, imaging/spectroscopy, sensors
E28 Ultra Wide Band Technology and Systems (**):Ultrawideband sensing, localization and communication techniques and applications, imaging and spectroscopy, system implementation, performance evaluation, Ultrawideband radar
E29 Emerging System Architectures:Optimized and highly integrated RF front-ends and architectures, digital/RF signal processing, advanced modulation techniques
E30 Wireless Power Transfer and Energy Harvesting:Shortand long-range device and system designs, nearfield and farfield techniques, high-power applications, rectifier circuits, energy harvesting techniques, circuits and devices
E31 Biological and Medical Applications:Diagnostic and therapeutic applications, biological and clinical measurement and treatment systems, wireless medical sensors and implants, body-area networks, medical telemetry and telemedicine, smart home microwave applications
E32 Wireless High Data Rate Communications and Cognitive Radio:3G/4G/5G systems, software-defined radio, wireless transceiver systems
E33 RFID, Near Field Communication, Microwave/Wireless Sensors and Sensor Networks:Including non-destructive testing and crowd sensing
E34 Process Automation, Mobility, and Logistics:Industry 4.0, intelligent transport systems and smart logistics, machine-to-machine communications, smart metering, smart cars and other

声明:

1、以上会议非活动家网站主办或承办会议,活动家网站学术会议频道会议信息来自于互联网,方便用户了解行业信息,如需参会、报名、获取会议邀请函或会议日程,请直接与学术会议活动主办单位联系。

2、部分会议内容来自互联网,由于网络的不确定性,活动家网站对所发布的信息不承担真实性的鉴别工作,请谨慎选择。若您发现会议页面信息有误,请联系活动家客服028-69761252纠错。

3、欢迎各行业学术会议举办方在活动家网站自行发布学术会议信息,发布活动请点击发布活动

会议标签:

互联网 网络 AR 学术会议 微波

温馨提示
酒店与住宿: 异地参会客户请注意,为防止会议临时变动,建议您先与活动家客服确认参会信息,再安排出行与住宿事宜。
退款规则: 活动各项资源需提前采购,购票后不支持退款,可以换人参加。

相关会议

分享到

QQ好友 QQ空间 微博 ×