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第三届电子工程和信息科学国际会议

第三届电子工程和信息科学国际会议

2016-01-04 08:00 至 2016-01-05 18:00

哈尔滨  

报名截止

推荐会议:DAMS2024中国数据智能管理峰会(上海)

发票类型:增值税普通发票 增值税专用发票

第三届电子工程和信息科学国际会议(简称ICEEIS2016),将于2016年1月4-5日在黑龙江省哈尔滨市举行。

(第三届电子工程和信息科学国际会议)

The 3rd International Conference of Electronic Engineering and Information Science 2016 (ICEEIS2016) will be held from Jan 4~5, 2016 in Haerbin, P.R. China. This conference is sponsored by Harbin University of Science and Technology. The conference will continue the excellent tradition of gathering world-class researchers, engineers and educators engaged in the fields of electronic engineering and information science to meet and present their latest activities.

ICEEIS is sponsored by CRC Press, is supposed to be the largest technical event on electronic engineering and information science in Haerbin in 2016. The focus of the conference is to establish an effective platform for institutions and industries to share ideas and to present the works of scientists, engineers, educators and students from all over the world. The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to ICEEIS2016.

The topics of ICEEIS2016 cover semiconductor materials, nano materials, mechanical materials, MEMS materials' electronics engineering, information sceince and other topics. 

Categories Conference Fee

Authors (Student)*    350 USD / 2200RMB
Authors (Non Student)*    400 USD / 2400RMB
Listeners    200 USD / 1200RMB 

会议标签:

信息科学 半导体 移动互联网 大数据

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