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2017年第三届半导体物理与器件国际会议(ICSPD)

2017年第三届半导体物理与器件国际会议(ICSPD)

2017-01-03 08:00 至 2017-01-05 18:00

曼谷   None

Engineering Information Institute(工程信息研究院)    

报名截止

推荐会议:ESIS 2024第三届中国电子半导体数智峰会

发票类型:增值税普通发票 增值税专用发票

-会议内容-

The 3rd Int'l Conference on Semiconductor Physics and Devices (ICSPD 2017) will be held from January 3 to 5, 2017 in Bangkok, Thailand. This Conference will cover issues on Semiconductor Physics and Devices. It dedicates to creating a stage for exchanging the latest research results and sharing the advanced research methods in the fields of Semiconductor Physics and Devices.
ICSPD 2017 will be co-located with the following conferences:

The 3rd Conference on Astrophysics and Space Science (APSS 2017)
The 6th Conference on Computational Mechanics (CCM 2017)
The 3rd Conference on New Advances in Acoustics (NAA 2017)
The 3rd Conference on Magnetism and Its Applications (MIA 2017)

The aim of ICSPD 2017 is to provide a stage for researchers, engineers, academicians as well as industrial professionals from all over the world to present their latest research results and advanced research methods in Semiconductor Physics and Devices. ICSPD 2017 will be a valuable and important platform for inspiring international and interdisciplinary exchange at the forefront of Semiconductor Physics and Devices.
On behalf of Engineering Information Institute, we cordially invite you to participate in ICSPD 2017 and look forward to seeing you in Bangkok, during January 3-5, 2017. Bangkok, the city once known as Siam, remarkably known to be exotic and rich in culture, is the cultural, economic and political capital of Thailand. The city features both old-world charm and modern convenience. Amidst the gleaming skyscrapers of Bangkok, one would still see traditional architectures such as temples, illustrating the retention of its identity whilst being a cosmopolitan city.
We look forward to your active support and participation.

-主办方介绍-

Engineering Information Institute(工程信息研究院) Engineering Information Institute(工程信息研究院)

工程信息研究院,是一个国际学术机构,收集与发布最新的国际学术会议信息,促进学术交流和国际合作,每年与美国电气和电子工程师协会(IEEE)、汤姆逊公司(Thomson)、科学信息研究所(ISI)和美国科研出版社(SRP)等多家知名机构以及全球知名大学和科研机构合作举办国际学术会议。

2017年第三届半导体物理与器件国际会议(ICSPD)

-会议门票-

Only Registration Fee(No Oral Presentation)

Item

Before January 3, 2017

Attendee

USD390/RMB2360


Registration Fee Includes:

  • Conference Materials(Including one Name Card,one hard copy of the Conference Guide and one hard copy of the Conference Proceeding)

  • All Technical Sessions during the whole conference

  • Lunch Buffet during the conference(January 4,5)

  • Dinner Buffet during the conference(January 4)

  • Coffee Break

会议标签:

半导体 物理

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