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会议详情 |
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发票类型：增值税普通发票 增值税专用发票
2014第十二届IEEE固态和集成电路国际会议将于2014年10月28日-31日在广西桂林举行，欢迎大家报名参加！
会议背景：
The ICSICT-2014 conference is the 12th in the series aiming to provide an international forum for the presentation and discussion of recent advances in solid-state and integrated circuit technology. The conference will be held on Oct.28-31, 2014 in Guilin, China. All aspects of solid-state devices, circuits, processing technologies, materials and other related research are within the scope of the conference. The three days of contributed and invited presentations on the latest developments in diverse fields given in oral and poster exchange as well as a stimulating environment for mutual communication among participants. An exhibition of equipment and materials as well as IC Design tools for solid state and integrated circuit technologies will be held concurrently with the conference. In addition, there will be discussions devoted to opportunities for cooperation and joint ventures in the microelectronics business in China. Excellent Student Paper Award will be presented at the closing of the conference.
会议议题：
(1) Silicon integrated circuits and manufacturing
(2) Digital, Analog, Mixed Signal IC and SOC design technology
(3) Low-power devices & circuits
(4) RF Circuits, Systems and their applications
(5) IC Computer-Aided –Design technology, DFM
(6) System-Level Modeling & Simulation/Verification and Synthesis / Optimization
(7) Advance memories technology (Flash, FeRAM, PCM，RRAM, MRAM etc.)
(8) Silicon/germanium devices and device physics
(9) Interconnect, Low K, High K and other process technologies
(10) Displays, sensors and MEMS
(11) Unconventional and nano-electronics
(12) Organic semiconductor devices and technologies
(13) Compound semiconductor devices and circuits
(14) Semiconductor materials and material characterization
(15) Reliability
(16) Processing/Devices/Circuits Modeling and simulation
(17) Packaging and testing technology
(18) Equipment technology
(19) Solar cell & other devices for new energy sources
(20) Other related topics
会议时间地点：
时间：2014年10月28日-31日
地点：桂林桂山华星大酒店（穿山路42号）
9:00‐9:45, Oct. 29, 2014 Grand Ballroom
K‐1 Semiconductor Technology: Trends, Challenges, and
Opportunities
Dr. Gary Patton, SRDC VP IBM, USA
9:45‐10:30, Oct. 29, 2014 Grand Ballroom
K‐2 Challenges Facing China IC Foundries and SMIC's
Strategies and Roadmaps
Dr. ShiuhWuu Lee，VP, SMIC, China
11:00‐11:45, Oct. 29, 2014 Grand Ballroom
K‐3 Circuit/architecture/process technology interaction
Dr. Kevin Zhang，Intel，USA
11:45‐12:30, Oct. 29, 2014 Grand Ballroom
K‐4 The Internet of Things – The Dawning of a New Era
Dr. Rich Goldman, VP, Synopsys, USA
8:30‐9:15, Oct. 30, 2014 Grand Ballroom
K‐5 Resistive Correlated-electron Random Access Memories
(CeRAMs)
Dr. Carlos Paz de Araujo, President of Symetrix /Professor, UCCS, USA
9:15‐10:00, Oct. 30, 2014 Grand Ballroom
K‐6 Bionic skins using flexible organic devices
Prof. Takao Someya, Tokyo University, Japan
8:30‐9:15, Oct. 31, 2014 Grand Ballroom
K‐7 Ubiquitous Mobile Computing - Growth Driver for the
Semiconductor Industry: Technology Trend, Challenges and
Opportunities
Dr. Geoffrey Yeap，Qualcomm Company,USA
9:15‐10:00, Oct. 31, 2014 Grand Ballroom
K-8 Terahertz Electronics
Dr. Michael Shur, Chair Professor, RPI, USA
会议报名截止日期：2014年9月15日
参会费：2400元/人
费用包含：会务费、会议资料（程序册、含电子版论文集的U盘等）、参加宴会和招待会、3天伙食（大会组委会为参会代表提供自大会开幕式第一天（自10月29日）至大会闭幕式（10月31日）三天期间的午餐和晚餐，包括招待会和宴会）等。
费用不包含：交通、住宿费自理（大会组委会为参会代表在桂山华星大酒店和环球大酒店安排了住宿，费用自理）。
会场路线：
如何前往桂山华星大酒店？
1、乘机抵达桂林机场，搭乘的士45分钟左右可以抵达酒店（约29.5公里）。
2、乘坐火车抵达桂林火车南站，搭乘的士10分钟可以抵达酒店（约3.6公里）。
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2014-10-28 00:00 至 2014-10-31 00:00
