2019年智能芯片设计与半导体电路国际会议（ICDSC 2019）

AI ChipDesign
Analog and mixed-signal circuits 
Analog signal processing
Chip-to-chip communications
Circuit technologies 
Circuits/devices modeling, verification and testing 
Data converters and Data storage
Digital architectures and systems
Digital integrated circuits
Digital/synthesizable voltage regulators and plls
Emerging ic and system 
Energy harvesting circuits and systems
Hardware-security circuits
High-bandwidth i/o interfaces
Image sensors and companion chips
Intra-chip communication circuits
Intelligent Chip
Memory design and Memory/ssd controllers
Memory-subsystem enhancements
Mems-based integrated systems
Micro-controllers and Microprocessors
Nano electronics circuits
Power control and management 
Processing-in-memory
Processors/ multiprocessors 
Reconfigurable architectures & FPGA-based designs
RF integrated circuits and microwave engineering 
Sensor interface circuits
Special-purpose digital circuits
Subthreshold and near-threshold circuits
Switched-mode power supplies
System-level power management
Ultrasonic sensors, neural interfaces and closed-loop systems
Wide-bandgap-semiconductor
Wireless sensing, radar and localization

工程信息研究院，是一个国际学术机构，收集与发布最新的国际学术会议信息，促进学术交流和国际合作，每年与美国电气和电子工程师协会（IEEE）、汤姆逊公司（Thomson）、科学信息研究所（ISI）和美国科研出版社（SRP）等多家知名机构以及全球知名大学和科研机构合作举办国际学术会议。