2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

初稿截稿日期：2019-01-15

TOPICS

• ADVANCED PACKAGING

Single Chip and Multi Chip Packaging, Wafer Level Packaging, 3D-WLP, 3D-IC, CoB, SiP, SoC, Systems-Integration Technologies, Embedded Passives on Wafers and Substrates, High Frequency and High Power Packaging, LTCC Technologies, Micro-Vias and Build-Up Technologies, Lab-on-Chip, Lab-on-Substrate, Molecular Electronics.

• SUBSTRATE TECHNOLOGIES

Inorganics, Organics, Co-fired, Flexibles, HD PCBs, Laminates, Printed, Microfluidics, Substrates Design and Technologies.

• INTERCONNECTION TECHNOLOGIES

Thick and Thin Film Technologies, Wire Bonding, Bumping, Flip Chip Bonding, Cu/Low-k Wafers, Through Silicon Vias, Advances in Soldering, Adhesive Joining, Connectors.

• MORE THAN MOORE

The future of IC shrinkage, the future options for IC packaging.

• MEMS

MEMS Based Sensors and Actuators Packaging, RF-MEMS, Optical MEMS, Bio-MEMS, WiFi modules.

• OPTOELECTRONICS

Silicon Photonics, Power LED Assembly, Packaging and Light Guiding, Packaging of Optoelectronic Modules suitable for Gb/s Fibre OpticCommunication, LiFi modules.

• SOLAR ENERGY & PHOTOVOLTAICS

Packaging Design to improve Efficiency of Photovoltaic modules, Reliability and Qualification Approaches.

• NANO TECHNOLOGIES

Smart Materials, Interconnections, Nano-Scale Packaging: Applications and Reliability.

• GREEN ELECTRONICS

Recovery and Recycling, Base material technologies.

• MEDICAL ELECTRONICS

Applications, Design, Development, Manufacturing that comply with complex and demanding regulations and market requirements.

• POWER ELECTRONICS

Application in Consumer, Telecom, Automotive, Wearable, Space and Defence, Fuel Cells, Battery Technologies.

• SMART TEXTILES

Wearables, Materials, Technologies, Applications, Markets, Reliability.

• MANUFACTURING TECHNOLOGIES AND MATERIALS

Process Development, New Equipment, Clean Room Technologies, Yield Improvement, Cost and Cycle Time Reduction, Green Manufacturing, Micromachining, Dispensing, Printing, Deposition, Adhesives, Encapsulants, Underfills, Moulding Compounds, Advanced Solder Alloys, Halogen Free Materials, Dielectrics, Ceramics.

• MODELLING

Electrical Modelling and Signal Integrity: Time and Frequency Domain Analysis of Interconnection and Packaging Technologies, Thermal Characterisation and Cooling Solutions, Modelling and Simulation Methodology for Characterisation of Advanced Packaging, Modules and Systems, Novel Cooling Techniques, Mechanical Modelling and Structural Integrity, Thermo-Mechanical Stress Analysis, Vibration and Shock Tests.

• THERMAL MANAGEMENT

Techniques, Heatsinks, Heat pumping.

• RELIABILITY and QUALITY

Specialised topics, Components, Counterfeits, Board and System Level Reliability Assessment, Failure Analysis, Interfacial Adhesion, Accelerated Testing, Reliability Engineering, Inspection and Test, Obsolescence Engineering, Prognostics.

• COMPUTING

Ambient Intelligence methods and products, Circuits and Systems, Touch Screen technologies.

• APPLICATIONS

Medical, Bio-Tec, Telecoms, Mobile, Smart Phones, RFID, Automotive, Aerospace, Robotics, Consumer, Structural

• BUSINESS ASPECTS

Electronics and Photonics, In-house or Outsource?, Markets, Supply Chain, Distribution, Microelectronics packaging and assembly industry